Research
Crystallization of germanium films
We are investigating low cost deposition methods to obtain germanium films on large areas.
Such layers enable new and improved large area electronic applications, by using the excellent optical and electrical
properties of germanium.
We have developed a method consisting of low temperature deposition and annealing, leading to excellent
solid phase epitaxial growth of germanium on silicon substrates.
The advantages of this method are:
- low thermal budget (400 °C is sufficient)
- Plasma-enhanced chemical vapor deposition (PECVD) can be used
» ideal for large scale applications - fast overall process (extreme fast deposition and RTA)
- easily scalable to large areas (> 8 inch)
- excellent structural quality
- high electrical quality (carrier mobilities of more than 80 % higher than Si(001) demonstrated)
- smooth interface (< 1 nm RMS roughness, no mixing)
- smooth surface (0.4 nm RMS roughness obtained)

FIG. 1. Comparison of X-ray diffraction (XRD) ω/2θ scans of as-deposited (black, solid line with squares) and crystallized (blue, solid line) amorphous Ge on Si(111). An intense and narrow Ge(111) diffraction peak is observed, indicating high crystal quality. The presence of fringes indicates a smooth Ge surface and interface between Ge and Si.

FIG. 2. XRD Reciprocal space map of crystallized Ge on Si(111) for the (331) reflection. The Ge layer is under slight tensile strain, which is induced by thermal mismatch.

